DC6 – Diffusion Layers, Soldering Concepts, and Thermal Management Components for Magnesium-Based Thermoelectric Devices
Objective: Study diffusion barriers and solder materials for magnesium-based thermoelectrics and develop flexible, additively manufactured metallic heat exchangers to enhance thermal management in cooling systems.
Host Institution: Consejo Superior de Investigaciones Científicas (CSIC)
Location: Madrid, Spain
Main Supervisor: Dr. Marisol Martin-Gonzalez (CSIC), Spain
Co-Supervisors: Dr. Hao Yin, TEGnology (Denmark), Prof. Dr. Johannes de Boor, DLR (Germany)
Duration: 36 months (full-time employment)
PhD-awarding Institution: Universidad Autónoma de Madrid
Project Overview
DC6 will focus on the development and evaluation of diffusion barrier layers, advanced soldering concepts, and thermal management components for magnesium-based thermoelectric devices used in solid-state cooling applications.
The project will address interdiffusion prevention, contact resistance minimisation, and long-term mechanical and thermal stability of thermoelectric modules. Significant emphasis will be placed on robust contact and efficient heat extraction concepts compatible with industrial fabrication routes.
The project will combine interface engineering, materials processing, and thermal design to establish interconnection-performance relationships and ensure integration compatibility with module assembly and system-level cooling activities within the consortium.
Research Tasks and Training Objectives
The Doctoral Candidate (m/f/div) will:
- Develop and optimise diffusion barrier layers to prevent interdiffusion and degradation in magnesium-based thermoelectric devices
- Design and assess soldering and joining concepts compatible with Mg-based thermoelectric materials
- Characterise electrical, thermal, and mechanical behaviour of interfaces and joints
- Investigate degradation and reliability under thermal cycling and operational conditions
- Design and evaluate advanced thermal management components with the aid of advanced 3D printing technologies (e.g., adaptable heat exchangers) for efficient heat removal
- Support integration of interconnection and thermal solutions into thermoelectric modules
- Collaborate closely with materials, modelling, and module-focused DCs within the network
- Participate in secondments, network-wide scientific training, and transferable skills activities
- Disseminate research results through peer-reviewed publications, international conferences, and outreach initiatives
Secondments
To strengthen interdisciplinary and intersectoral training, DC6 will undertake the following secondments:
- TEGnology (Denmark) – 2 months
Focus: Industrial module assembly, soldering strategies, and device-level validation - IFW Dresden (Germany) – 3 months
Focus: Advanced characterisation of diffusion barriers and interface evolution - DLR (Germany) – 2 months
Focus: Integration of thermal management components into cooling demonstrators and system-level evaluation
Required Qualifications
Education
- Master’s degree (or equivalent) in Materials Science, Physics, Chemistry, Engineering, or a closely related field
Technical Competences
- Strong background in materials interfaces, thin films or device integration
- Experience with experimental materials processing and characterization
- Knowledge of thermal management concepts and heat transfer principles is advantageous
- Understanding of electrical and thermal transport phenomena is beneficial
- Interest in thermoelectric devices and energy-efficient cooling technologies
Personal Skills
- Strong analytical and experimental problem-solving skills
- Ability to work independently and within an international interdisciplinary research network
- Excellent written and spoken English
Join MGICIAN as a Doctoral Candidate
Apply now and become part of MGICIAN as a Doctoral Candidate. Shape the future of sustainable solid-state cooling with us.